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Symposium August 26-27, 2015 | Tutorials August 28, 2015

JOIN US! At the Oracle Santa Clara Campus, CA in 2015!



Join us for our 23rd year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia.

This year's best papers on interconnect microarchitecture will be invited to submit extended versions of their papers to a special edition of IEEE Micro.

Our objective is to address the Data-Center Networking and the Supercomputing communities. This year we are proud to have Fabrizio Petrini, IBM T.J. Watson, as our 2015 IEEE Hot Interconnects General Chair.

We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.



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IMPORTANT DATES
(Papers)

Abstract due:   May 4
Paper due:      May 11
Notification:    June 15
IEEE Micro: January 6

IMPORTANT DATES
(Tutorials)

Proposals due:     May 4
Notification:      May 25
Materials due: August 7

IMPORTANT DATES
(Travel Awards)

Application due: June 22
Announcements: June 29

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