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Symposium August 15-16, 2019 | Tutorials August 14, 2019


JOIN US! At the Intel Headquarters, Santa Clara, CA in 2019!

Join us for our 26th year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia.

Our objective is to address the Data-Center Networking and the Supercomputing communities. This year we are proud to have Don Draper, Oracle, and Eitan Zahavi, Mellanox, as our 2019 IEEE Hot Interconnects General Chairs.

We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.

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IMPORTANT DATES
(Papers)

Submission deadline
(extended):
May 17

Notification: June 7

IMPORTANT DATES (Tutorials)

Proposals due: May 10

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