Message from the General Chair

Welcome to the campus of Stanford University for the 11th annual Hot Interconnects Conference. This conference serves as the forum where designers and architects from leading companies and universities meet to discuss how new technologies can switch, route, and process packets sent over high-speed networks. Further, this conference explores how recent advances in circuit, wireless, and optic technologies will enable faster and more reliable transmission of data. Networks are the critical technology which move data within a chip, among processors in a cluster, over local area networks, and across wide area networks.

Our conference enjoys strong participation from participants in academia, industry, venture capitalists, and the government. We share common goals to identify and exploit new technologies that can improve the way in which information is exchanged. I hope that you enjoy the conference keynotes, technical presentations, panel discussion, and tutorials.

I would especially like to thank our organizing and steering committees

I thank our patrons for providing financial assistance with this conference.Publicity support was provided by:

Lastly, we thank our conference sponsor


John W. Lockwood
Washington University