Hot Interconnects 9 A Symposium on High Performance Interconnects at Stanford University on August 22 - 24, 2001


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CALL FOR PAPERS

HOT INTERCONNECTS 9

A Symposium on High Performance Interconnects

Memorial Auditorium, Stanford University, Aug. 22-24, 2001

(Sponsored by the IEEE Computer Society)

 

Hot Interconnects is an international symposium focusing on the hardware and software architecture and implementation of high-performance interconnects of all scales. Its themes include cross-cutting issues spanning computer systems and networking technologies for providing universal services over packet networks. Examples of relevant topics include network-attached storage, transport of voice and video over packet networks, high-performance network interfaces, novel switching and routing technologies capable of providing differentiated services, plug-and-play network interfaces, and active network architectures. The conference is directed particularly at new and exciting product and technology innovations in these areas. Contributions should focus on real products, prototypes, or experimental systems and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited on the following topics:
 
- Gb/sec and Tb/sec switching and routing technologies
- High-speed packet processing engines
- Serial link technologies
- xDSL, HFC, and wireless access technologies
- Mobility-enabling technologies
- Seamless appliance interconnectivity
- Network-attached storage devices and interfaces
- Video and voice over packet networks
- Wireless and mobile network interfaces
- Network security
- Next-generation networking chip sets
- Network protocols on a chip
- Low-power networking and interconnect technologies
- Network appliance technologies
- Optical Interconnects
 

Submission Guideline

Submissions must be in the form of an extended summaries and should not exceed 5 pages (double-column format). The summary should have sufficient technical detail to judge its quality and suitability for presentation at the conference. Guidelines for submission are available at our Electronic Submission Page.
Inquires about the conference should be directed to the TPC chairs.
 
 

Important Dates

 - Submission deadline: May 8, 2001.
 - Notification of acceptance: June 20, 2001.
 - Camera-ready due: July 10, 2001.

 

For more information mail info@hoti.org

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