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TECHNICAL CO-SPONSORSHIP

TC on Scalable Computing (TCSC) TC on Computer Architecture (TCCA) TC on High Speed Networking (TCHSN) TC on Communications Switching and Routing (TCCSR) TC on Optical Networking (ONTC)

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IEEE Hot Interconnects 13 Committees Steering Committee   Allen Baum, Intel Daniel Pitt, Dean of Engineering, Santa Clara University Mark Laubach, Broadband Physics  Hasan Alkhatib, IP Dynamics John Lockwood, Washington University in St. Louis   Organizing Committee     General Co-Chairs James Sterbenz, University of Kansas and Lancaster University, UK   Dimitrios Stiliadis, Bell Labs     Technical Program Co-Chairs Fabrizio Petrini, Los Alamos National Laboratory   Tal Lavian, Nortel Networks Labs and University of California at Berkeley     Publications Chair TBA     Sponsor/Patron Chair Mark Laubach     Treasurer Maria Isabel Meija     Publicity Chair TBA     Local Arrangements Chair Registration Chair Volunteer Coordinator Webmaster Liz Rogers, LRD Group     Technical Program Committee Adnan Aziz, University of Texas, Austin Alan Benner, IBM STSM (Server/Network Technology and Architecture) Andrea Fumagalli, University of Texas, Dallas Andrea Bianco, Politecnico di Torino Anujan Varma, University of California, Santa Cruz Bryan Lyles, Telecordia Craig Stunkel, IBM Danny Raz, Technion Dimitrios Stiliadis, Bell Labs Doan Hoang, University of Sidney Fabio Chiussi, Invento Networks Gigi Karmous-Edwards, MCNC Grid Computing and Network Services Hans Eberle, Sun James Sterbenz, University of Kansas and Lancaster University Jay Lepreau, University of Utah Joe Mambretti, Northwestern University John Lockwood, Washington University in St. Louis Paolo Giaccone, Politecnico di Torino Patricia Sagmeister, IBM Research Zurich Ron Brightwell, Sandia National Laboratory Reuven Cohen, Technion Sharad Agarwal, Microsoft Silvia Figueira, Santa Clara University Tom DeFanti, University of Illinois at Chicago Yuval Shavitt, Tel Aviv University Wojciech Kabacinski, Poznan University of Technology, Poland