IEEE Hot Interconnects | Stanford University

IEEE Hot Interconnects 15 Committees

Steering Committee

Allen Baum, Intel

Daniel Pitt, Dean of Engineering, Santa Clara University

John Lockwood, Washington University in St. Louis


Organizing Committee

General Co-Chairs	John Lockwood, Stanford University
	Fabrizio Petrini , IBM TJ Watson

Technical Program Co-Chairs	Ron Brightwell, Sandia National Laboratories
	Dhabalaswar (DK) Panda, The Ohio State University

Publication Chair	Luca Valcarenghi, Scuola Superiore Sant'Anna

Publicity Chairs	Weikuan Yu, Oak Ridge National Laboratory

Finance Chair	Herzel Ashkenazi, Xilinx

Tutorial Chair	Luca Valcarenghi, Scuola Superiore Sant'Anna

Local Arrangements Chair	Songkrant Muneenaem, Washington University in St. Louis

Webmaster	Liz Rogers, LRD Group

2007 Program Committee

Dennis Abts, Cray, Inc.
Adnan Aziz, University of Texas, Austin
Alan Benner, IBM
Keren Bergman, Columbia University
Andrea Bianco, Politecnico di Torino
Piero Castoldi, Scuola Superiore Sant'Anna
Sarang Dharmapurikar, Nuova Systems
Hans Eberle, Sun Microsystems Laboratories
Wu-chun Feng, Virginia Tech
Juan Fernandez, University of Murcia
Ada Gavrilovska, Georgia Institute of Technology
Paolo Giaccone, Politecnico di Torino
Mitchell Gusat, IBM Zurich Research Laboratory
Ron Ho, Sun Microsystems Laboratories
Doan Hoang, University of Technology, Sydney
Jayasimha Jay, Intel
Isaac Keslassy, Technion
Venkata Krishnan, Dolphin Interconnect Solutions
Tal Lavian, Nortel Networks Labs, UC Berkeley
Bill Lin, University of California, San Diego
Olav Lysne, Simula Research Laboratory
Pankaj Mehra, HP Labs
Rami Melhem, University of Pittsburgh
Cyriel Minkenberg, IBM Zurich Research Laboratory
Gregory Pfister, IBM
Craig Stunkel, IBM, T.J. Watson Research Center
Anujan Varma, University of California at Santa Cruz
Zuoguo (Joe) Wu, Intel