IEEE Hot Interconnects | Stanford University

Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from on-chip processor--memory interconnects to wide-area networks. This yearly conference is very well attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below. (click here for a downloadable, printable PDF)

Call for Papers

•	Novel and innovative interconnect architectures
•	Multicore processor interconnects
•	System-on-Chip Interconnects
•	Advanced chip-to-chip communication technologies
•	Optical interconnects
•	Protocol and interfaces for interprocessor communication
•	Survivability and fault-tolerance of interconnects
•	High-speed packet processing engines and network processors
•	System and storage area network architectures and protocols
•	High-performance host–network interface architectures
•	High-bandwidth and low-latency I/O
•	Tb/s switching and routing technologies
•	Innovative architectures for supporting collective communication
•	Novel communication architectures to support grid computing

Submission Guideline
•	Submission deadline: April 30, 2008
•	Notification of acceptance: May 31, 2008
•	Papers need sufficient technical detail to judge quality and suitability for presentation.
•	Submit title, author, abstract, and full paper (eight pages, double-column, IEEE format).
•	Industrial Forum - A special session of short invited papers will be collected by Dennis Abts and Keren Bergman.
•	Papers should be submitted electronically at http://edas.info/newPaper.php?c=6393& for Hot Interconnects 16.

About the Conference
•	Conference held at Stanford University.
•	Papers selected will be published in proceedings by the IEEE Computer Society.
•	Presentations are 30-minute talks in a single-track format
•	Online information at http://www.hoti.org