Join us for our 15th
year of an information packed three day Symposium about
the latest in High Performance Interconnects. IEEE
Hot Interconnects brings
together architects and designers of high performance
chips, software, and systems at the University and global
business levels. Presentations focus on the latest technological developments of the leading engineers and researchers in the field.
Two days of technical sessions led by John Lockwood, Stanford University and Fabrizio Petrini, IBM TJ Watson, our 2007 General Co-Chairs followed by one day of tutorials to keep you on top
of the latest
developments and academic laboratories.
Registration NOW OPEN. Our objective is to address the Networking and Supercomputing
year we are proud to have Ron Brightwell with Sandia National Laboratories and Dhabaleswar
Panda from Ohio State University as our 2007 IEEE Hot Interconnects Program
Co-Chairs. They are putting together a combined 'HOT' program that includes interconnects